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Special Issue to be published in Computational Geosciences

Coupled Thermal-Hydro-Mechanical-Chemical Processes in Fractured Media: Microscale to Macroscale Numerical Modeling

Aims and Scopes

The intent of this special issue is to publish descriptions of a set of numerical models that analyze THMC processes ranging from microscale (micron to centimeter) to macroscale (meter to kilometer), with special application to subsurface fractures and fractured geological media. Each manuscript will include a description of the relevant numerical models, and may include comparison to experimental or field data for the purposes of validation.

Based on the results of the International Conference on coupled processes in fractured geological media: observation, modeling, and application, which will be held in Wuhan, China on November 12-14 of 2018, the planned topics of the special issue will include:

  • Continuum approaches for large-scale THMC coupling in fractured media
  • Numerical approaches for mechanical-chemical processes at the microscale
  • Numerical approaches forTHMC coupling in discrete fracture networks
  • Reactive transport modeling of multiscale fracture evolution
  • Hydraulic, thermal, and chemical induced fracturing
  • Long term multicomponent diffusion of contaminants
  • High performance computing for 3D heterogeneous flow and transport in fractures
  • Numerical modeling and analysis of THMC processes in nuclear waste disposal, geothermalexploitation, petroleum engineering, and shale gas exploitation

Instructions for Authors
Authors should follow Computational Geosciences manuscript requirements:

Acceptance Criteria
Submitted manuscripts will be reviewedby 2-3 reviewers from the International Scientific Advisory Committee or Organizing Committee members

Editors for Volume
Jonny Rutqvist, Lawrence Berkeley National Laboratory, USA
Carl Steefel, Lawrence Berkeley National Laboratory, USA
Mengsu Hu, Lawrence Berkeley National Laboratory, USA

Special Issue Timeline
Submission of manuscripts:  May 1, 2019
Return of reviews: August 1, 2019
Revised manuscripts due:  October 1, 2019
Publication:  March 1, 2020